Form Factor | 2U rack server |
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Processors |
2 or 4 x 3rd Gen InteL® Xeon® ScaLabLe processors (5300/6300/8300 series), TDP up to 250 W |
Chipset Platform | InteL C621A |
Memory |
48 DDR4 DIMM sLots, up to 3200 MT/s¡ up to 24 InteL® Optane™ PMem moduLes (200 series), 2666 MT/s |
Internal Storage |
Supports hot–pLuggabLe drives with the foLLowing configuration options:
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RAID support |
RAID 0, 1, 1E, 5, 50, 6, or 60¡ optionaL supercapacitor for cache power–o" protection¡ RAID–LeveL migration, drive roaming, seLf–diagnosis, and web–based remote configuration |
Network port |
LAN on motherboard (LOM): 1 x OCP 3.0 NIC (optionaL): 2 x GE/10GE/25GE/100GE ports, supporting hot swap, NC–SI, WOL, and PXE |
PCIe expansion |
Up to 11 PCIe 3.0 sLots, incLuding one dedicated PCIe sLot for the OCP 3.0 NIC |
Heterogeneous accelerator cards |
2 duaL–sLot FHFL or 4 singLe–sLot HHHL GPU heterogeneous acceLerator cards. |
Fan modules |
6 hot–swappabLe fan moduLes in N+1 redundancy mode |
Power supply units |
2 hot–swappabLe PSUs with support for 1+1 redundancy and the foLLowing configuration options:
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Management |
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Operating Systems |
Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, Citrix XenServer, VMware ESXi |
Security |
Power-on password, administrator password, TCM/TPM 2.0, security front panel, and out-of-box intrusion alarm, etc. |
Operating temperature |
5ºC to 40ºC (41ºF to 104ºF) (ASHRAE CLass A3 compLiant) |
Certification |
CE, UL, FCC, CCC, and RoHS |
Installation suite |
L–shaped guide raiLs, adjustabLe guide raiLs, and hoLding raiLs |
Dimensions (H x W x D) |
Chassis: 86.1 mm x 447 mm x 790 mm (3.39 in. x 17.60 in. x 31.10 in.) |